3D CoSeedis™ Chips - A new standard in 3D cell culture

With the 3D CoSeedis™ Chip family of products, abc biopply set new standards in 3D cell culture. The chips are designed to offer an optimum of flexibility in terms of throughput and compatibility to numerous applications.
The 3D CoSeedis™ chips come in three different versions:

 

The 3D CoSeedis™ Chip200 for the production of 200 organoids per chip is compatible with 6-well plates. It is ideally suited for a variety of applications, such as:
  • Long term cultures of organoids up to 70 days
  • The aggregation of non-spheroidal cell types
  • Contact and distance co-cultures to mimic cell-to-cell and organ-to-organ communication across physical barriers

The 3D CoSeedis™ Chip880 for the production of 880 organoids per chip for 6-well plates. It is optimised for clonal growth of spheroids or conical aggregates and is perfectly suited to grow and harvest large number of 3D constructs under identical conditions.
The 3D CoSeedis™ Chip680 for the production of 680 organoids per chip for 24-well plates. It has been specifically designed for:
  • The production of large quantities of homogeneous and uniform spheroids for HTS/HCS applications. One plate of the 3D CoSeedis™ Chip680 generates more than 16’000 spheroids.
  • The aggregation of primary or stem cell organoids and spheroids. It is ideally suited for a limited number of cells. Similarly, it limits media consumption to a minimum and thereby reduces consumable costs.
  • The 3D CoSeedis™ Chip680 is perfect for the aggregation of 3D spheroids form clonal cells.

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The 3D CoSeedis™ platform is modular in its setup and co-culture methods can be combined at leisure to mimic more or less complex cellular interactions. It is nevertheless, easy in handling and robust and reliable in its results.
 
Interested? Please do not hesitate to contact me for a more detailed introduction into the fascinating world of 3D CoSeedis™. Likewise, you may visit our website to watch our interesting tutorial or webinars. And please follow us on LinkedIn to stay tuned on the latest developments on 3D CoSeedis™.
 
I am looking forward to telling you more about the 3D CoSeedis™ Chip family.
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   Best regards

   Marco Leu, PhD
   Sales & Operation
   abc biopply ag

   Direct Email / Phone +41 (0)79 834 95 56

 

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